Beijing Haina Lean Technology Co., Ltd 86-010-57158440 marina@hnl-electronic.com

Rigid Flex 1oz High Density Pcb Multilayer Oem Gold Plating

Products - HDI PCB Board

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Product Name

HDI PCB Board
Material

FR4, 94v0 Circuit Board
Copper Thickness

1OZ
Min. Line Spacing/width

0.1＊0.1mm
Min. Hole Size

0.12mm
Service

One-stop Service,PCB&PCBA,ODM And OEM
PCB Assembly Method

Mixed, SMT, And THT ETC.
Board Thickness

1.6mm
DK

1.42
Surface Treatment

GOLD PLATING
Place of Origin

CHINA
Brand Name

HNL-PCBA
Certification

ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
Model Number

PCB Assembly 08
Minimum Order Quantity

3PC
Price

Negotiable
Packaging Details

ESD packaging with carton box
Delivery Time

1-7days
Payment Terms

T/T, Western Union, L/C, MoneyGram
Supply Ability

10,000,000 Point /Day

Rigid Flex 1oz High Density Pcb Multilayer Oem Gold Plating

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1OZ Multilayer 4Layer OEM GOLD PLACTING HDI PCB Board

HDI PCB Board Introduction

High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology. Due to the continuous development of technology and the electrical requirements for high-speed signals, the circuit board must provide impedance control with AC characteristics, high-frequency transmission capability, and reduce unnecessary radiation (EMI). Adopting the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality problem of signal transmission, insulating materials with low dielectric constant and low attenuation rate are used. In order to meet the miniaturization and arraying of electronic components, the density of circuit boards is constantly increasing to meet the demand.

PCB CAPABILITIES

FACTORY CAPABILITIES
No.	Items	2020
1	HDI Capabilities	HDI ELIC(5+2+5)
2	Max layer count	46L
3	Board Thickness	Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4	Min.Hole Size	Laser 0.05mm
		Mechnical 0.15mm
5	Min Line Width/Space	0.030mm/0.030mm
6	Copper Thickness	1/3oz-6oz
7	Size Max Panel size	700x610mm
8	Registration Accuracy	+/-0.05mm
9	Routing Accuracy	+/-0.05mm
10	Min.BGA PAD	0.125mm
11	Max Aspect Ratio	10:01
12	Bow and Twist	0.50%
13	Impedance Control Tolerance	+/-5%
14	Daily output	4,000m2 (Max capacity of equipment)
15	Surface Finishing	HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16	Raw Material	FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

PCBA Capability
Material Type	Item	Min	Max
PCB	Dimension (length,width,height.mm)	50400.38	6004004.2
Components	Chip&IC	1005	55mm
	BGA Pitch	0.3mm	-
	QFP Pitch	0.3mm	-

The types of HDI PCB

1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.

Rigid Flex 1oz High Density Pcb Multilayer Oem Gold Plating 0

Work flow for HDI

Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment

RoHS stack-up Blind Buried Vias hole HDI PCB 1

RoHS stack-up Blind Buried Vias hole HDI PCB 2

Delivery Time

Product Type	Qty	Normal lead time	Quick-turn lead time
SMT+DIP	1-50	1WD-2WD	8H
SMT+DIP	51-200	2WD-3WD	1.5WD
SMT+DIP	201-2000	3WD-4WD	2WD
SMT+DIP	≥2001	4WD-5WD	3WD
PCBA(2-4Layer)	1-50	2.5WD-3.5WD	1WD
PCBA(2-4Layer)	51-2000	5WD-6WD	2.5WD
PCBA(2-4Layer)	≥2001	≥7WD	5WD
PCBA(6-10Layer)	1-50	3WD-4WD	2.5WD
PCBA(6-10Layer)	51-2000	7WD-8WD	6WD
PCBA(10-HDILayer)	1-50	7WD-9WD	5WD
PCBA(10-HDILayer)	51-2000	9WD-11WD	7WD

HDI PCB Board Application Field

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.

Rigid Flex 1oz High Density Pcb Multilayer Oem Gold Plating 3

Workshop

Rigid Flex 1oz High Density Pcb Multilayer Oem Gold Plating 5

Common packaging

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box

Rigid Flex 1oz High Density Pcb Multilayer Oem Gold Plating 6

Rigid Flex 1oz High Density Pcb Multilayer Oem Gold Plating 7

FAQ

Q1:What kind of PCB file format can you accept for production?
Gerber, PROTEL 99SE, PROTEL DXP, CAM350, ODB+(.TGZ)

Q2:Is my PCB files safe when I submit them to you for manufacturing?

We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from you, nor we'll share these files with any other 3rd parties.

Q3:What payments do you accept ?
-Telex Transfer(T/T),Western Union,Letter of Credit(L/C)
-Paypal,AliPay,Credit Card

Q4:How to get the PCB?
A:For small packages, we will ship the boards to you by DHL,UPS,FedEx,EMS. Door to door service! You will get your PCBs at your home.
B:For heavy goods more than 300kg, we may ship your boards by ship or by air to save freight cost. Of course, if you have your own forwarder, we may contact them for dealing with your shipment.

Q5:What is your minimum order quantity?
Our MOQ is 1 PCS.

Q6: Can we visit your company?

No problem. You are welcome to visit us in Beijing. Or the branch factory is in Tianjin.

Q7: How can you ensure the quality of the PCB?
Our PCBs are 100% test including Flying Probe Test, E-test and AOI.

Rigid Flex 1oz High Density Pcb Multilayer Oem Gold Plating 8

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