Beijing Haina Lean Technology Co., Ltd 86-010-57158440 marina@hnl-electronic.com
OEM Low Volume CEM-3 Base Contract Pcb Assembly

OEM Low Volume CEM-3 Base Contract Pcb Assembly

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    low volume contract electronic assembly

  • Product Name
    Contract PCB Assembly
  • Base Material
    CEM-3
  • Copper Thickness
    1/3oz
  • Min. Line Width/spacing
    0.030mm/0.030mm
  • Board Thickness
    0.3-4mm
  • Surface Finishing
    HASL Lead Free
  • Min. Hole Size
    Laser 0.05mm Mechnical 0.15
  • Usage
    Communications, OEM Electronics Etc.
  • Type
    Electronic Board,printing Circuit Board,Customizable,PCBA Design
  • Pcb Test
    Flying Probe And AOI (Default)/Fixture Test
  • Place of Origin
    CHINA
  • Brand Name
    HNL-PCBA
  • Certification
    ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
  • Model Number
    PCB Assembly 02
  • Minimum Order Quantity
    1 PC
  • Price
    Negotiable
  • Packaging Details
    ESD packaging with carton box
  • Delivery Time
    1-7days
  • Payment Terms
    T/T, Western Union, L/C, MoneyGram
  • Supply Ability
    10,000,000 Point /Day

OEM Low Volume CEM-3 Base Contract Pcb Assembly

6Layers SMT Electronic Board Assembly BGA Contract PCB Assembly

 

Contract PCB Assembly Introduction

 

Contract PCB assembly is for one particular customer when a contract manufacturer assembles the PCBs at their manufacturing facility

PCBA meaning is to mount with components on PCB board and the manufacturing process. PCB is no use without components are mounted on the advanced circuit board, and it won't be able to give its functionality. These PCB boards require more design work than other wiring methods, but the assembly and manufacturing tend to be automated afterward. The automation makes PCB boards the cheapest and most efficient option.

 

Contract PCB Assembly CAPABILITIES 

Base material FR4,High-TG FR4,CEM3,aluminum, High frequency(Rogers,Taconic,Aron,PTFE,)
Layers 1-46
Copper Thickness 0.3oz,0.5oz, 1oz, 2oz, 3oz,4oz,5oz, 6oz
Dielectric Thickness 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm
board Core Thickness 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm,
1.5mm, 2.0mm, 3.0mm and 3.2mm
Board Thickness 0.3mm - 4.0mm
Thickness Tolerance +/-10%
Surface Finishing HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP
Solder Mask Color Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Legend Color Black, White etc
Assembly Types Surface mount
Thro-hole
Mixed technology (SMT & Thru-hole)
Single or double sided placement
Conformal coating
Shield cover assembly for EMI emission control
Parts Procurement Full Turnkey, Partial Turnkey, Kitted / Consigned
Component types SMT 01005 or larger
BGA 0.4mm pitch, POP (Package on Package)
WLCSP 0.35mm pitch
Hard metric connectors
Cable & wire
Other Techniques Free DFM Review
Box Build Assembly
100% AOI test and X-ray test for BGA
Components cost-down
Function test as custom
Protection technology

 

PCBA CAPABILITIES

 

PCBA Capability
Material type PCB Components
Item Dimension (Length, width,height. mm) Material Surface finish Chip&IC BGA Pitch QFP Pitch
Min 50*40*0.38 FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC HASL, OSP, Immersion gold, Flash Gold Finger 1005 0.3mm 0.3mm
Max 600*400*4.2    

 

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology.

These solutions include:

7 high-speed placement machines, 7 automatic printers with fiducial alignment, 2 X-ray machines, BGA maintenance machines, ICT test machines

 

Our DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

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Contract PCB Assembly Process

 

1.Solder Paste stenciling
2.Surface Mount Technology (Pick and Place)
3.Reflow Soldering
4.Inspection and Quality Control
5.Through-Hole Component Insertion (DIP Process)
6.Final Inspection and Functional Test

 

In-process control for placement accuracy of components can be ensured by inline and secondary automatic optical inspection (AOI). BEIJING HAINA LEAN’s reflow operation, which is performed in a 13-zone oven, ensures proper profile and temperature ramp (± 2°/s) to eliminate thermomechanical overstress due to wide variance in thermal exposure. This is especially critical on large, fine-pitch devices (e.g. BGAs, etc).

OEM Low Volume CEM-3 Base Contract Pcb Assembly 0

 

Our advantage

 

Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

In-process control for placement accuracy of components can be ensured by inline and secondary automatic optical inspection (AOI). BEIJING HAINA LEAN’s reflow operation, which is performed in a 13-zone oven, ensures proper profile and temperature ramp (± 2°/s) to eliminate thermomechanical overstress due to wide variance in thermal exposure. This is especially critical on large, fine-pitch devices (e.g. BGAs, etc).

 

OEM Low Volume CEM-3 Base Contract Pcb Assembly 1

OEM Low Volume CEM-3 Base Contract Pcb Assembly 2

 

Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

 

Contract PCB Assembly Application Field 

 

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.

 

OEM Low Volume CEM-3 Base Contract Pcb Assembly 3

 

Workshop

 

OEM Low Volume CEM-3 Base Contract Pcb Assembly 4

OEM Low Volume CEM-3 Base Contract Pcb Assembly 5

OEM Low Volume CEM-3 Base Contract Pcb Assembly 6

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

OEM Low Volume CEM-3 Base Contract Pcb Assembly 7

OEM Low Volume CEM-3 Base Contract Pcb Assembly 8

OEM Low Volume CEM-3 Base Contract Pcb Assembly 9

 

Certification 

 

OEM Low Volume CEM-3 Base Contract Pcb Assembly 10

OEM Low Volume CEM-3 Base Contract Pcb Assembly 11

Welcome to HAINA LEAN TECHNOLOGY company. SMT, reflow soldering, wave soldering, and three defenses are all used in automated production. Whole assembly process is also an assembly line production. It is precisely because of the meticulous spirit of integration that the production of high-quality and efficient core products can be guaranteed.