6Layers SMT Electronic Board Assembly BGA Contract PCB Assembly

 

Contract PCB Assembly Introduction

 

Contract PCB assembly is for one particular customer when a contract manufacturer assembles the PCBs at their manufacturing facility. 

PCBA meaning is to mount with components on PCB board and the manufacturing process. PCB is no use without components are mounted on the advanced circuit board, and it won't be able to give its functionality. These PCB boards require more design work than other wiring methods, but the assembly and manufacturing tend to be automated afterward. The automation makes PCB boards the cheapest and most efficient option.

 

Contract PCB Assembly CAPABILITIES 

Base material	FR4,High-TG FR4,CEM3,aluminum, High frequency(Rogers,Taconic,Aron,PTFE,)
Layers	1-46
Copper Thickness	0.3oz,0.5oz, 1oz, 2oz, 3oz,4oz,5oz, 6oz
Dielectric Thickness	0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm
board Core Thickness	0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm,
	1.5mm, 2.0mm, 3.0mm and 3.2mm
Board Thickness	0.3mm - 4.0mm
Thickness Tolerance	+/-10%
Surface Finishing	HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP
Solder Mask Color	Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Legend Color	Black, White etc
Assembly Types	Surface mount
	Thro-hole
	Mixed technology (SMT & Thru-hole)
	Single or double sided placement
	Conformal coating
	Shield cover assembly for EMI emission control
Parts Procurement	Full Turnkey, Partial Turnkey, Kitted / Consigned
Component types	SMT 01005 or larger
	BGA 0.4mm pitch, POP (Package on Package)
	WLCSP 0.35mm pitch
	Hard metric connectors
	Cable & wire
Other Techniques	Free DFM Review
	Box Build Assembly
	100% AOI test and X-ray test for BGA
	Components cost-down
	Function test as custom
	Protection technology

 

PCBA CAPABILITIES

 

PCBA Capability
Material type	PCB			Components
Item	Dimension (Length, width,height. mm)	Material	Surface finish	Chip&IC	BGA Pitch	QFP Pitch
Min	50*40*0.38	FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC	HASL, OSP, Immersion gold, Flash Gold Finger	1005	0.3mm	0.3mm
Max	600*400*4.2

 

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology.

These solutions include:

7 high-speed placement machines, 7 automatic printers with fiducial alignment, 2 X-ray machines, BGA maintenance machines, ICT test machines

 

Our DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

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Contract PCB Assembly Process

 

1.Solder Paste stenciling
2.Surface Mount Technology (Pick and Place)
3.Reflow Soldering
4.Inspection and Quality Control
5.Through-Hole Component Insertion (DIP Process)
6.Final Inspection and Functional Test

 

In-process control for placement accuracy of components can be ensured by inline and secondary automatic optical inspection (AOI). BEIJING HAINA LEAN’s reflow operation, which is performed in a 13-zone oven, ensures proper profile and temperature ramp (± 2°/s) to eliminate thermomechanical overstress due to wide variance in thermal exposure. This is especially critical on large, fine-pitch devices (e.g. BGAs, etc).

 

Our advantage

 

Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

In-process control for placement accuracy of components can be ensured by inline and secondary automatic optical inspection (AOI). BEIJING HAINA LEAN’s reflow operation, which is performed in a 13-zone oven, ensures proper profile and temperature ramp (± 2°/s) to eliminate thermomechanical overstress due to wide variance in thermal exposure. This is especially critical on large, fine-pitch devices (e.g. BGAs, etc).

 

 

Delivery Time 

 

 

Contract PCB Assembly Application Field 

 

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.

 

 

Workshop

 

 

Common packaging

PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

 

Certification 

 

Welcome to HAINA LEAN TECHNOLOGY company. SMT, reflow soldering, wave soldering, are all used in automated production. Whole assembly process is also an assembly line production. It is precisely because of the meticulous spirit of integration that the production of high-quality and efficient core products can be guaranteed.