OEM FR4 CEM1 CEM3 Ceramic Circuit Board PCB Assembly Prototype

 

PCB Assembly Prototype Introduction

 

For no proper printed circuit boards without designing, PCB Prototype is the basic way for making the circuit boards.

Our experience to build PCB prototypes is just 24 hours.

The prototype PCB assembly section of our manufacturing facility has a unique layout that allows for flexible use of both automated and manual parts-loading stations.

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs.

 

PCB CAPABILITIES 

 

FACTORY CAPABILITIES
No.	Items	2019	2020
1	HDI Capabilities	HDI ELIC (4+2+4)	HDI ELIC(5+2+5)
2	Max layer count	32L	36L
3	Board Thickness	Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm	Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4	Min.Hole Size	Laser 0.075mm Mechnical 0.15	Laser 0.05mm Mechnical 0.15
5	Min Line Width/Space	0.035mm/0.035	0.030mm/0.030mm
6	Copper Thickness	1/3oz-4oz	1/3oz-6oz
7	Size Max Panel size	700x610mm	700x610mm
8	Registration Accuracy	+/-0.05mm	+/-0.05mm
9	Routing Accuracy	+/-0.075mm	+/-0.05mm
10	Min.BGA PAD	0.15mm	0.125mm
11	Max Aspect Ratio	10:1	10:1
12	Bow and Twist	0.50%	0.50%
13	Impedance Control Tolerance	+/-8%	+/-5%
14	Daily output	3,000m2 (Max capacity of equipment)	4,000m2 (Max capacity of equipment)
15	Surface Finishing	HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16	Raw Material	FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material Type	Item	Min	Max
PCB	Dimension (length,width,height.mm)	50*40*0.38	600*400*4.2
	Material	FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
	Surface finish	HASL,OSP,Immersion gold,Flash Gold Finger
Components	Chip&IC	1005	55mm
	BGA Pitch	0.3mm	-
	QFP Pitch	0.3mm	-

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology. These solutions include:

7 high-speed placement machines,

7 automatic printers with fiducial alignment,

2 X-ray machines,

BGA maintenance machines,

ICT test machines

 

Our DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

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PCB Assembly Prototype Process

 

1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test

 

 

PCB Assembly Prototype Delivery Time 

 

Product Type	Qty	Normal lead time	Quick-turn lead time
SMT+DIP	1-50	1WD-2WD	8H
SMT+DIP	51-200	2WD-3WD	1.5WD
SMT+DIP	201-2000	3WD-4WD	2WD
SMT+DIP	≥2001	4WD-5WD	3WD
PCBA(2-4Layer)	1-50	2.5WD-3.5WD	1WD
PCBA(2-4Layer)	51-2000	5WD-6WD	2.5WD
PCBA(2-4Layer)	≥2001	≥7WD	5WD
PCBA(6-10Layer)	1-50	3WD-4WD	2.5WD
PCBA(6-10Layer)	51-2000	7WD-8WD	6WD
PCBA(10-HDILayer)	1-50	7WD-9WD	5WD
PCBA(10-HDILayer)	51-2000	9WD-11WD	7WD

 

PCB Assembly Prototype Application Field 

 

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.

 

 

 

Workshop

 

 

PCB Assembly Prototype Common packaging

PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box