Double sided PCBs have two sided traces with a top and bottom layer. Assembler mount conductive copper and components on both sides of the circuit board, which allows the traces to cross over each other. This results in a higher density of circuits without the need of point-to-point soldering. For these types of circuit boards are more complex than single sided PCBs, it would be more difficult to produce.
However, the benefits of using double sided PCBs far outweigh the cons.
The double-sided PCB boards can add more components and have more space as needed. It can also reduce the circuit board’s size and use a more flexible design to make the most desired double-sided PCB board. And it can save cost better and achieve good circuit performance and heat dissipation function.
|1||HDI Capabilities||HDI ELIC (4+2+4)||HDI ELIC(5+2+5)|
|2||Max layer count||32L||36L|
|3||Board Thickness||Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm||Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm|
|4||Min.Hole Size||Laser 0.075mm||Laser 0.05mm|
|Mechnical 0.15mm||Mechnical 0.15mm|
|5||Min Line Width/Space||0.035mm/0.035mm||0.030mm/0.030mm|
|7||Size Max Panel size||700x610mm||700x610mm|
|11||Max Aspect Ratio||10:1||10:1|
|12||Bow and Twist||0.50%||0.50%|
|13||Impedance Control Tolerance||+/-8%||+/-5%|
|14||Daily Output||3,000m2 (Max capacity of equipment)||4,000m2 (Max capacity of equipment)|
|15||Surface Finishing||HASL lead free/ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD|
|16||Raw Material||FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI|
|Item||Dimension (Length, width,height. mm)||Material||Surface finish||Chip&IC||BGA Pitch||QFP Pitch|
|Min||50*40*0.38||FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC||HASL, OSP, Immersion gold, Flash Gold Finger||1005||0.3mm||0.3mm|
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology.
These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.
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Double Side PCB Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
Independent quotation system to quickly serve the market
High-tech PCB and PCB assembly production line
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
Printed circuit boards And PCB Assembly are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box