Payment & Shipping Terms:
|Product Name:||High Frequency PCB||Material:||FR-4 HASL Lead Free IMMERSION TIN|
|Min. Line Width/spacing:||0.030mm||Board Thickness:||0.3mm, 1.6mm, 2mm, ...... 3.5mm|
|Min. Hole Size:||Laser 0.05mm ; Mechnical 0.15||Solder Mask Color:||Green, White,Black. Blue(Customized)|
|Craftsmanship:||HASL，HASL PB FREE， Immersion Gold/Tin/Silver， Gold Finger Plating OSP，Immersion Gold + OSP||Pcb Standard:||IPC-A-610 D,IPC-A-610 D/IPC-III Standard,IPC-II Standard/IPC-III Standard|
RoHS Double Sided Printed Circuit Board,
HF Double Sided Printed Circuit Board,
High Frequency RoHS Compliant PCB
And developing new products always use high frequency substrate, satellite system, mobile telephone receiving base station and so on, these communication products must use high frequency PCB.
Produce HDI board, Fast PCB board, RF PCB board, PCBA, high frequencyPCB board ,high speed board and rigid-flex board, etc., to meet customers' various demands. We have handled hundreds of thousands of PCB projects, and covered almost all kinds of substrate materials including FR4, Aluminum, Rogers, etc. Our factory is the first class manufacturer of HDI PCB , and undertake various board PCB services, including 1-46, HDI, thick copper layer, rigid flex, high frequency, Rogers+FR-4 mixed medium volume, lamination, buried aluminum, copper substrate, plate making proofing or quick expedited PCB proofing.
In the next few years, they will inevitably develop rapidly, and high-frequency substrates will be in large demand.
The features of high frequency PCB as following:
1. DK should be small and stable enough, usually the smaller the better, high DK may lead to signal transmission delay.
2. DF should be small, which mainly affect quality of signal transmission, the smaller DF could make smaller signal wastage accordingly.
3. The thermal expansivity should be the same with copper foil as much as possible, because the difference will lead to copper foil separated in the changes of cold and heat.
4. Water absorptivity must be low, high water absorptivity will affect DK and DF when in the wet environment.
5. Heat resisting property, chemistry resisting, impact endurance, peel off resisting must be good.
Generally speaking, high frequency can be defined as frequency above 1GHz. Currently, polyfluortetraethylene(PTFE) material is widely used in high frequency PCB manufacturing, it's also called Teflon, which frequency is normally above 5GHz. In addition, FR4 or PPO substrate can be used to the product frequency among 1GHz~10GHz.
|1||HDI Capabilities||HDI ELIC (4+2+4)||HDI ELIC(5+2+5)|
|2||Max layer count||32L||36L|
|3||Board Thickness||Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm||Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm|
|4||Min.Hole Size||Laser 0.075mm||Laser 0.05mm|
|Mechnical 0.15mm||Mechnical 0.15mm|
|5||Min Line Width/Space||0.035mm/0.035mm||0.030mm/0.030mm|
|7||Size Max Panel size||700x610mm||700x610mm|
|11||Max Aspect Ratio||10:1||10:1|
|12||Bow and Twist||0.50%||0.50%|
|13||Impedance Control Tolerance||+/-8%||+/-5%|
|14||Daily Output||3,000m2 (Max capacity of equipment)||4,000m2 (Max capacity of equipment)|
|15||Surface Finishing||ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD|
|16||Raw Material||FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI|
Products are mainly exported to Europe and USA;
Our customers spread over more than 80 countries;
Products are widely used in various industries.
Multilayer PCB Craftsmanship
PCB Process: Wet process,Dry process
FOR MULTILAYER MANUFACTURE PROCESS: Laminate cut, scrubbing, Image transfer, internal layer, Exposure, Developing, ETCHING, black / brown oxygen, lay up, Laminating, Drilling, scrubbing, Plated through hole, PTH panel plating, pattern plating (plated resist), Etching, Inspection, Printing solder mask, Exposure, Developing, Hot Cured, Hot Air Leveling, IMMERSION GOLD, Printing legend ink (silkscreen printing), Hot Cured, Routing, punch, Bare board testing, Final Inspection, Packing, Delivery
Electronic Manufacturing Service
PCB Electronic Design
PCB Layout Service
PCB Supplier & Quality Inspection Service
PCBA Components Sourcing
PCB Assembly process service
|Double sides||9 Days||5 Days||45h|
|Four-layer||10 Days||5 Days||3 Days|
|Six-layer||12 Days||6 Days||3 Days|
|Eight-layer||12 Days||7 Days||4 Days|
|Ten-layer||14 Days||10 Days||4Days|
|Twelve-layer||14 Days||10 Days||5 Days|
|Fourteen-layer||16 Days||12Days||6 Days|
|Sixteen-layer||16 Days||12 Days||6 Days|
|Eighteen-layer||18 Days||14 Days||6 Days|
|Twenty-layer||18 Days||14 Days||10 Days|
|Twenty two-layer||20 Days||14 Days||10 Days|
|Twenty four-layer||20 Days||14 Days||10 Days|
|Twenty six-layer||20 Days||14 Days||10 Days|
|Twenty eight-layer||20 Days||14 Days||10 Days|
High Frequency PCB Application Field
Used for mobile phones, computers, MP4, DVB, LCD TV, LED, IPTV, instruments, household appliances, automobiles, electromechanical equipment and other high-tech electronic products.
1. Manual visual inspection of PCB board
2. PCB board online test
3. PCB board function test
4. AOI (Automatic optical inspection)
5. Automatic X-ray inspection
6. Laser detection system
7. Size detection
Above is the PCB testing service.
Haina lean Electronics provides custom test service according to client's requirements and products.
We offers a full range of testing service.
1. AOI(Automatic Optical Inspection)
2. Function Testing
3. In Circuit Testing
4. Testing Jig
5. Testing Service
6. X-Ray for BGA Testing
7. Printing Solder Paste Test
Each board is carefully examined by our dedicated inspection team using AOI and high magnification viewers.
Using our X-Ray machine, we test PCBs to component level and all wiring is fully inspected and tested.
Flash testing and earth bonding tests can also be undertaken where required.
PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box
Haina lean Electronics Co., Ltd is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.
Here is strong component supply chain and procceurement team. Prototype and mass production are available. Competitive price is for high-quality and services. Exported to worldwide customer in US, Europe, Canada.
Contact Person: Silvia