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ENIG multi-layering 1oz HDI Printed Circuit Board

ENIG multi-layering 1oz HDI Printed Circuit Board

  • Product Name
    ENIG Multi-layering 1oz HDI Printed Circuit Board
  • Material
    FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
  • Copper Thickness
    0.3oz...1oz 2oz ...6oz
  • Min. Line Spacing
    0.030mm,0.05mm ETC.
  • Min. Hole Size
    0.05mm, 0.1mm, 0.25mm, 0.1mm/4mil, 4mil, 0.02
  • Usage
    OEM Electronics,Circuit Board Assembly
  • Board Thickness
    0.3mm,,,1.6mm,,,3.5mm
  • Solder Mask
    Green. Black. Red. Yellow. White. Blue Etc.; Custom
  • Type
    Buried Vias And Through Vias
  • Surface Finishing
    ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
  • Place of Origin
    CHINA
  • Brand Name
    HNL-PCBA
  • Certification
    ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
  • Model Number
    PCB Assembly 012
  • Minimum Order Quantity
    1 PC
  • Price
    Negotiable
  • Packaging Details
    ESD packaging with carton box
  • Delivery Time
    1-7days
  • Payment Terms
    T/T, Western Union, L/C, MoneyGram
  • Supply Ability
    10,000,000 Point /Day

ENIG multi-layering 1oz HDI Printed Circuit Board

ENIG Multi-Layering 1oz HDI Printed Circuit Board

HDI PCB Board Introduction

High Density Interconnection (HDI) PCB is a kind of (technology) for the production of printed circuit boards. It is a circuit board with relatively high circuit distribution density using micro blind via and buried via technology. Due to the continuous development of technology and the electrical requirements for high-speed signals, the circuit board must provide impedance control with AC characteristics, high-frequency transmission capability, and reduce unnecessary radiation (EMI). Adopting the structure of Stripline and Microstrip, multi-layering becomes a necessary design. In order to reduce the quality problem of signal transmission, insulating materials with low dielectric constant and low attenuation rate are used. In order to meet the miniaturization and arraying of electronic components, the density of circuit boards is constantly increasing to meet the demand.


PCB (Printed circuit board) is the most import role in the Electronic time, the electronic products which we can think of will need the PCB board, We are manufacture with year's experience in PCB & PCBA solutions .

 

 

PCB CAPABILITIES

 
FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size Laser 0.075mm Laser 0.05mm
Mechnical 0.15mm Mechnical 0.15mm
5 Min Line Width/Space 0.035mm/0.035mm 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily Output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
 

The types of HDI PCB


1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.

 

HDI (High Density Interconnection) circuit boards usually include laser blind vias and mechanical blind vias; general through buried vias, blind vias, stacked vias, staggered vias, cross blind buried, through vias, blind via filling plating, fine line small gaps, The technology of realizing the conduction between the inner and outer layers by processes such as micro-holes in the disk, usually the diameter of the blind buried is not more than 6 mils.

 

 

ENIG multi-layering 1oz HDI Printed Circuit Board 0

 

Work flow for HDI

 

Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment

 

ENIG multi-layering 1oz HDI Printed Circuit Board 1

 

Similar products

 

ENIG multi-layering 1oz HDI Printed Circuit Board 2

ENIG multi-layering 1oz HDI Printed Circuit Board 3

 

HDI PCB Board Application Field 

 

Our PCB are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.

 

 

Workshop

 

ENIG multi-layering 1oz HDI Printed Circuit Board 4ENIG multi-layering 1oz HDI Printed Circuit Board 5

 

ENIG multi-layering 1oz HDI Printed Circuit Board 6

 

Common packaging

 

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box

 

ENIG multi-layering 1oz HDI Printed Circuit Board 7

 

 

Our advantage

 

1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

 

ENIG multi-layering 1oz HDI Printed Circuit Board 8