Multilayer PCB Assembly Introduction
We use high technology options like blind via, buried via, controlled dielectric, controlled impedance, and more for building every multilayer PCB assembly. We adopt the advanced tools and methods to manage the designs.
We have a professional team who are experienced in handling this delicate process. Our aim to build multifunctional assemblies that serve all your purposes with space limitations to meet your needs.
Base material | FR4,High-TG FR4,CEM3,aluminum, High frequency(Rogers,Taconic,Aron,PTFE,) |
Layers | 1-46 |
Copper Thickness | 0.3oz,0.5oz, 1oz, 2oz, 3oz,4oz,5oz, 6oz |
Dielectric Thickness | 0.05mm, 0.075mm, 0.1mm,0.15mm,0.2mm |
board Core Thickness | 0.4mm,0.6mm, 0.8mm, 1.0mm, 1.2mm, |
1.5mm, 2.0mm, 3.0mm and 3.2mm | |
Board Thickness | 0.3mm - 4.0mm |
Thickness Tolerance | +/-10% |
Surface Finishing | HASL lead free,ENIG,Plated Gold,Immersion Gold,OSP |
Solder Mask Color | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
Legend Color | Black, White etc |
Assembly Types | Surface mount |
Thro-hole | |
Mixed technology (SMT & Thru-hole) | |
Single or double sided placement | |
Conformal coating | |
Shield cover assembly for EMI emission control | |
Parts Procurement | Full Turnkey, Partial Turnkey, Kitted / Consigned |
Component types | SMT 01005 or larger |
BGA 0.4mm pitch, POP (Package on Package) | |
WLCSP 0.35mm pitch | |
Hard metric connectors | |
Cable & wire | |
Other Techniques | Free DFM Review |
Box Build Assembly | |
100% AOI test and X-ray test for BGA | |
Components cost-down | |
Function test as custom | |
Protection technology |
SMT capabilities:
SMT Assembly: SMT provides a flexible high technology.
These solutions include:
7 high-speed placement machines, 7 automatic printers with fiducial alignment, 2 X-ray machines, BGA maintenance machines, ICT test machines
DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.
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Multilayer PCB Assembly Process
1.Solder Paste stenciling
2.Surface Mount Technology (Pick and Place)
3.Reflow Soldering
4.Inspection and Quality Control
5.Through-Hole Component Insertion (DIP Process)
6.Final Inspection and Functional Test
Service value
Independent quotation system to quickly serve the market
PCB manufacturing
High-tech PCB and PCB assembly production line
Material purchasing
A team of experienced electronic component procurement engineers
SMT post soldering
Dust-free workshop, high-end SMT patch processing
Product Type | Qty | Normal lead time | Quick-turn lead time |
SMT+DIP | 1-50 | 1WD-2WD | 8H |
SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Multilayer PCB Assembly Application Field
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.
Workshop
PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box