HASL 0.3oz Surface Mount Pcb Assembly Electronic Circuit PCB SMT Assembly
SMT development trend: 1. Higher process stability and reliability to meet mass production, professional production, reduce costs. 2. Higher assembly precision, to meet the micro-spacing device mounting, improve assembly density. 3. Higher technical content, adapt to the assembly of new device packaging. 4. It is conducive to environmental protection and human health.
We are devoted to PCBA one-step EMS in large quantities. Be the most professional PCBA servicer and manufacturer, One glance and you'll know you have found the right manufacturing partner!
We offer competitive pricing, as well as flexible shipment plans to you. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .
|Layers||1 - 46 L (Custom )|
|Substrate||FR-4,CTI600,Tg180,,Anti CAF,Halogen-free,,High frequency,Tg170&HF|
|Max. panel size||700x610mm (Custom)|
|Board thickness||0.3 mm - 3.5 mm.|
|Copper thickness||1/3 oz. to 6 oz. (outer) (Max)|
|Aspect Ratio||10 : 1|
|Min. track width||3.0 mils(partial)|
|Min. track space||3.0mils(partial)|
|Min. S/M bridge||3mil|
|Hole plugging diameter||0.3 mm~0.55 mm.|
|Impedance tolerance||+/- 10%.|
|Color of S/M||green,white,black,red,orange,yellow,blue,purple|
|Surface treatment||OSP,HAL,HAL LF,ENIG,Hard gold,Imm Ag,Imm Sn,Peelable soldermask,Carbon ink print,Selective hard gold|
|Material||FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC|
|Surface finish||HASL,OSP,Immersion gold,Flash Gold Finger|
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology.
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
PCB SMT Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
Independent quotation system to quickly serve the market
High-tech PCB and PCB assembly production line
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
|Product Type||Qty||Normal lead time||Quick-turn lead time|
Our products are widely used in
6.light-emitting diode lighting,
7.automotive electronics etc.
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
1.What are needed for quotation?
PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ......)
PCBA: PCB information, BOM, (Testing documents...)
2. What file formats do you accept for production?
Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)
3.Are my files safe?
Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third party.
There is no MOQ .We can flexibly handle small and mass production.
5.Shipping Cost ?
The shipping cost is determined by the destination ,weight ,packing size of the goods .We can provide shipping, air, land, express and other transportation services .
6.How to ensure high-quality production?
The process is strictly controlled under ISO 9001:2015 standards.
Most of our advanced equipment and tools are imported from abroad. Such as Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
We have a very professional QC team.