SMT is Surface Mount Technology. We fabricate PCB Assembly with SMT,DIP, BGA, QFP, as well as THT selective soldering.
SMT assembly as an alternative to the through-hole method of PCB manufacturing, is a method of placing electronic components and circuits onto PCBs. SMT assembly has a wide range of uses. It also has a few limitations your design team should consider.
FACTORY CAPABILITIES | |||
No. | Items | 2019 | 2020 |
1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
2 | Max layer count | 32L | 36L |
3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
Mechnical 0.15mm | Mechnical 0.15mm | ||
5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
7 | Size Max Panel size | 700x610mm | 700x610mm |
8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
10 | Min.BGA PAD | 0.15mm | 0.125mm |
11 | Max Aspect Ratio | 10:1 | 10:1 |
12 | Bow and Twist | 0.50% | 0.50% |
13 | Impedance Control Tolerance | +/-8% | +/-5% |
14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
15 | Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
PCBA Capability | |||
Material Type | Item | Min | Max |
PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | ||
Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
Components | Chip&IC | 1005 | 55mm |
BGA Pitch | 0.3mm | - | |
QFP Pitch | 0.3mm | - |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology. These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.
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PCB SMT Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
1.Service value Independent quotation system to quickly serve the market |
2.PCB manufacturing High-tech PCB and PCB assembly production line |
3.Material purchasing A team of experienced electronic component procurement engineers |
4.SMT post soldering Dust-free workshop, high-end SMT patch processing
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Product Type | Qty | Normal lead time | Quick-turn lead time |
SMT+DIP | 1-50 | 1WD-2WD | 8H |
SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.
Workshop
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box