Beijing Haina Lean Technology Co., Ltd 86-010-57158440 marina@hnl-electronic.com
FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype

  • High Light

    2 Layer PCB SMT Assembly

    ,

    AOI PCB SMT Assembly

    ,

    HDI PCB Assembly Prototype

  • Product Name
    PCB SMT Assembly
  • Material
    Fr-4 Normal Tg;HIGH Tg 170 HASL
  • Copper Thickness
    1/3OZ, Up To 6OZ
  • Min. Line Spacing
    0.030mm
  • Board Thickness
    0.3mm,1mm, 1.6mm, ......3.5mm
  • Min. Hole Size
    Laser 0.05mm ; Mechnical 0.15
  • Solder Mask Color
    Blue.green Etc; Customized
  • PCB Assembly Method
    Mixed; SMT, DIP, THT
  • Application
    Consumer Electronics,PCBA Circuit Board,Communications/Auto Electric,rigid Fpc
  • Type
    PCB Assembly,Customizable,Electronic Board,BMS
  • Place of Origin
    CHINA
  • Brand Name
    HNL-PCBA
  • Certification
    ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000
  • Model Number
    PCB Assembly 04
  • Minimum Order Quantity
    1 PC
  • Price
    Negotiable
  • Packaging Details
    ESD packaging with carton box
  • Delivery Time
    1-7days
  • Payment Terms
    T/T, Western Union, L/C, MoneyGram
  • Supply Ability
    10,000,000 Point /Day

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype

FR-4 ENIG 2layer HDI Circuit Board Prototype AOI PCB SMT Assembly

 

PCB SMT Assembly Introduction

Surface mount technology(SMT) is an area of electronic PCB assembly. SMT PCB fabricating & assembly does not only includes placing and soldering of components but also a wide array productions. We fabricate PCB Assembly with SMT,DIP, BGA, QFP, as well as THT selective soldering. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs. 

 

PCB CAPABILITIES

 

 

Layers 1 - 46 L (Custom )
Substrate FR-4,CTI600,Tg180,,Anti CAF,Halogen-free,,High frequency,Tg170&HF
Max. panel size 700x610mm (Custom)
Board thickness 0.3 mm - 3.5 mm.
Copper thickness 1/3 oz. to 6 oz. (outer) (Max)
Hole > 0.15mm.
Aspect Ratio 10 : 1
Min. track width 3.0 mils(partial)
Min. track space 3.0mils(partial)
Min. S/M bridge 3mil
Hole plugging diameter 0.3 mm~0.55 mm.
Impedance tolerance +/- 10%.
Color of S/M green,white,black,red,orange,yellow,blue,purple
Surface treatment OSP,HAL,HAL LF,ENIG,Hard gold,Imm Ag,Imm Sn,Peelable soldermask,Carbon ink print,Selective hard gold
 

PCBA CAPABILITIES

 

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology. These solutions include:

7 high-speed placement machines,

7 automatic printers with fiducial alignment,

2 X-ray machines,

BGA maintenance machines,

ICT test machines

 

Our DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

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PCB SMT Assembly Process

 

1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype 0

 

Our advantages

 

1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

 

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype 1

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype 2

 

PCB SMT Assembly Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

 

PCB SMT Assembly Application Field 

 

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.

 

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype 3

 

Workshop

 

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype 4

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype 5FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype 6

 

Common packaging

 

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box

 

FR-4 ENIG 2 Layer AOI PCB SMT Assembly , HDI PCB Assembly Prototype 7