Beijing Haina Lean Technology Co., Ltd 86-010-57158440 marina@hnl-electronic.com
OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

Products - PCB SMT Assembly
  • High Light

    6 Layer SMD PCB Assembly

    ,

    3 Mil SMD PCB Assembly

    ,

    OSP SMT PCBA

  • Product Name
    Printed Circuit SMT Board Assembly
  • Copper Thickness
    1/3oz-6oz
  • Min. Line Spacing / Width
    0.030mm / 0.030mm
  • Board Thickness
    0.3-3.5mm
  • Min. Hole Size
    Laser 0.05mm ; Mechnical 0.15
  • Solder Mask Color
    Blue.green.red.black.white.etc
  • Surface Finishing
    HASL,OSP,ENIG,HASL Lead Free,Immersion Gold
  • Material
    FR4 /Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
  • Application
    Communication Equipment, Industrial Control, Consumer Electronics, Medical Equipment, Aerospace, Light-emitting Diode Lighting, Automotive Electronics
  • Assembly Types
    Surface Mount, Thro-hole, Mixed Technology (SMT & Thru-hole), Single Or Double Sided Placement, Conformal Coating, Shield Cover Assembly For EMI Emission Control
  • Place of Origin
    CHINA
  • Brand Name
    HNL-PCBA
  • Certification
    ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
  • Model Number
    PCBA-01
  • Minimum Order Quantity
    1 PC
  • Price
    Negotiable
  • Packaging Details
    ESD packaging with carton box
  • Delivery Time
    1-7days
  • Payment Terms
    T/T, Western Union, L/C, MoneyGram
  • Supply Ability
    10,000,000 Point /Day

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

  • OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway
  • OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway
Get Price Contact Now

OSP 6 Layer 3 Mil Printed Circuit SMT Board Assembly For High Speed Railway

 

Printed Circuit SMT Board Assembly Introduction

Haina lean Electronics is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.

 

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .

 

PCB CAPABILITIES 

No. Items  
1 HDI Capabilities HDI ELIC(5+2+5)
2 Max layer count 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness0.3-3.5mm
4 Min.Hole Size Laser 0.05mm
Mechnical 0.15
5 Min Line Width/Space 0.030mm/0.030mm
6 Copper Thickness 1/3oz-6oz
7 Size Max Panel size 700x610mm
8 Registration Accuracy +/-0.05mm
9 Routing Accuracy +/-0.05mm
10 Min.BGA PAD 0.125mm
11 Max Aspect Ratio 10:01
12 Bow and Twist 0.50%
13 Impedance Control Tolerance +/-5%
14 Daily output 4,000m2 (Max capacity of equipment)
15 Surface Finishing ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

 

Our advantage

Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 0

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 1

 

Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

 

Printed Circuit SMT Board Assembly Application Field 

 

Assembled Printed Circuit Boards are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.

 

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 2

 

Workshop

 

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 3

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 4OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 5OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 6

 

Partners

 

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 7

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 8

 

 

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway 9

Tags:

6OZ PCB SMT Assembly

Finger Gold PCB SMT Assembly

Electronic PCB SMT Assembly

Related Cases

Our services cover all industries and reach all parts of the world.

Get a Quote