Multiple layer FR4 HASL Lead Free SMD DIP Printed Circuit Board PCB SMT Assembly

 

PCB SMT Assembly Introduction

 

Beijing Haina Lean has professional component procurement team, centralized procurement, and save your procurement costs, labor costs, quality costs. We offer competitive pricing, high quality products, as well as flexible shipment plans to you. 

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .

 

PCBA CAPABILITIES

 

Layers	1 - 36 L
Substrate	FR-4,CTI600,Tg180,,Anti CAF,Halogen-free,,High frequency,Tg170&HF
Max. panel size	700x610mm
Board thickness	0.3 mm - 3.5 mm.
Copper thickness	1/3 oz. to 6 oz. (outer) (Max)
Hole	> 0.15mm.
Aspect Ratio	10 : 1
Min. track width	3.0 mils(partial)
Min. track space	3.0mils(partial)
Min. S/M bridge	3mil
Hole plugging diameter	0.3 mm~0.55 mm.
Impedance tolerance	+/- 10%.
Color of S/M	green,white,black,red,orange,yellow,blue,purple
Surface treatment	OSP,HAL,HAL LF,ENIG,Hard gold,Imm Ag,Imm Sn,Peelable soldermask,Carbon ink print,Selective hard gold

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology. These solutions include:

7 high-speed placement machines,

7 automatic printers with fiducial alignment,

2 X-ray machines,

BGA maintenance machines,

ICT test machines

 

Our DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

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PCB SMT Assembly Process

 

1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test

 

Our advantage

 

1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

 

PCB SMT Assembly Delivery Time 

 

Product Type	Qty	Normal lead time	Quick-turn lead time
SMT+DIP	1-50	1WD-2WD	8H
SMT+DIP	51-200	2WD-3WD	1.5WD
SMT+DIP	201-2000	3WD-4WD	2WD
SMT+DIP	≥2001	4WD-5WD	3WD
PCBA(2-4Layer)	1-50	2.5WD-3.5WD	1WD
PCBA(2-4Layer)	51-2000	5WD-6WD	2.5WD
PCBA(2-4Layer)	≥2001	≥7WD	5WD
PCBA(6-10Layer)	1-50	3WD-4WD	2.5WD
PCBA(6-10Layer)	51-2000	7WD-8WD	6WD
PCBA(10-HDILayer)	1-50	7WD-9WD	5WD
PCBA(10-HDILayer)	51-2000	9WD-11WD	7WD

 

Electronic Board Assembly Application Field 

 

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.

 

 

Workshop

 

 

Common packaging

 

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box