The double-sided printed circuit board (also double-layer board)provides on both side conductive paths for assembly of components, then to fabricate the PCB'A.
Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .
FACTORY CAPABILITIES | |||
No. | Items | 2019 | 2020 |
1 | HDI Capabilities | HDI ELIC (4+2+4) | HDI ELIC(5+2+5) |
2 | Max layer count | 32L | 36L |
3 | Board Thickness | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm | Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm |
4 | Min.Hole Size | Laser 0.075mm | Laser 0.05mm |
Mechnical 0.15mm | Mechnical 0.15mm | ||
5 | Min Line Width/Space | 0.035mm/0.035mm | 0.030mm/0.030mm |
6 | Copper Thickness | 1/3oz-4oz | 1/3oz-6oz |
7 | Size Max Panel size | 700x610mm | 700x610mm |
8 | Registration Accuracy | +/-0.05mm | +/-0.05mm |
9 | Routing Accuracy | +/-0.075mm | +/-0.05mm |
10 | Min.BGA PAD | 0.15mm | 0.125mm |
11 | Max Aspect Ratio | 10:1 | 10:1 |
12 | Bow and Twist | 0.50% | 0.50% |
13 | Impedance Control Tolerance | +/-8% | +/-5% |
14 | Daily Output | 3,000m2 (Max capacity of equipment) | 4,000m2 (Max capacity of equipment) |
15 | Surface Finishing | ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD | |
16 | Raw Material | FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI |
PCBA Capability | |||
Material Type | Item | Min | Max |
PCB | Dimension (length,width,height.mm) | 50*40*0.38 | 600*400*4.2 |
Material | FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC | ||
Surface finish | HASL,OSP,Immersion gold,Flash Gold Finger | ||
Components | Chip&IC | 1005 | 55mm |
BGA Pitch | 0.3mm | - | |
QFP Pitch | 0.3mm | - |
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology. These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.
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Double Side PCB Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
1.Service value
Independent quotation system to quickly serve the market
2.PCB manufacturing
High-tech PCB and PCB assembly production line
3.Material purchasing
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
Product Type | Qty | Normal lead time | Quick-turn lead time |
SMT+DIP | 1-50 | 1WD-2WD | 8H |
SMT+DIP | 51-200 | 2WD-3WD | 1.5WD |
SMT+DIP | 201-2000 | 3WD-4WD | 2WD |
SMT+DIP | ≥2001 | 4WD-5WD | 3WD |
PCBA(2-4Layer) | 1-50 | 2.5WD-3.5WD | 1WD |
PCBA(2-4Layer) | 51-2000 | 5WD-6WD | 2.5WD |
PCBA(2-4Layer) | ≥2001 | ≥7WD | 5WD |
PCBA(6-10Layer) | 1-50 | 3WD-4WD | 2.5WD |
PCBA(6-10Layer) | 51-2000 | 7WD-8WD | 6WD |
PCBA(10-HDILayer) | 1-50 | 7WD-9WD | 5WD |
PCBA(10-HDILayer) | 51-2000 | 9WD-11WD | 7WD |
Our products are widely used in the following areas:
1. communication equipment,
2. industrial control,
3.consumer electronics,
4.medical equipment,
5. aerospace,
6.light-emitting diode lighting,
7.automotive electronics etc
Workshop
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box