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OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

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OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway
OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

Large Image :  OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

Product Details:
Place of Origin: CHINA
Brand Name: HNL-PCBA
Certification: ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
Model Number: PCBA-01
Payment & Shipping Terms:
Minimum Order Quantity: 1 PC
Price: Negotiable
Packaging Details: ESD packaging with carton box
Delivery Time: 1-7days
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Detailed Product Description
Product Name: Printed Circuit SMT Board Assembly Copper Thickness: 1/3oz-6oz
Min. Line Spacing / Width: 0.030mm / 0.030mm Board Thickness: 0.3-3.5mm
Min. Hole Size: Laser 0.05mm ; Mechnical 0.15 Solder Mask Color: Blue.green.red.black.white.etc
Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold Material: FR4 /Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
Application: Communication Equipment, Industrial Control, Consumer Electronics, Medical Equipment, Aerospace, Light-emitting Diode Lighting, Automotive Electronics Assembly Types: Surface Mount, Thro-hole, Mixed Technology (SMT & Thru-hole), Single Or Double Sided Placement, Conformal Coating, Shield Cover Assembly For EMI Emission Control
High Light:

6 Layer SMD PCB Assembly

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3 Mil SMD PCB Assembly

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OSP SMT PCBA

OSP 6 Layer 3 Mil Printed Circuit SMT Board Assembly For High Speed Railway

 

Printed Circuit SMT Board Assembly Introduction

Haina lean Electronics is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.

 

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .

 

PCB CAPABILITIES 

No. Items  
1 HDI Capabilities HDI ELIC(5+2+5)
2 Max layer count 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness0.3-3.5mm
4 Min.Hole Size Laser 0.05mm
Mechnical 0.15
5 Min Line Width/Space 0.030mm/0.030mm
6 Copper Thickness 1/3oz-6oz
7 Size Max Panel size 700x610mm
8 Registration Accuracy +/-0.05mm
9 Routing Accuracy +/-0.05mm
10 Min.BGA PAD 0.125mm
11 Max Aspect Ratio 10:01
12 Bow and Twist 0.50%
13 Impedance Control Tolerance +/-5%
14 Daily output 4,000m2 (Max capacity of equipment)
15 Surface Finishing ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

 

Our advantage

Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

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Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

 

Printed Circuit SMT Board Assembly Application Field 

 

Assembled Printed Circuit Boards are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.

 

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Workshop

 

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Partners

 

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Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

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Contact Details
Beijing Haina Lean Electronic CO., LTD

Contact Person: Marina

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