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OEM Quick Turn EMS High Volume PCB Assembly

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OEM Quick Turn EMS High Volume PCB Assembly

OEM Quick Turn EMS High Volume PCB Assembly
OEM Quick Turn EMS High Volume PCB Assembly OEM Quick Turn EMS High Volume PCB Assembly

Large Image :  OEM Quick Turn EMS High Volume PCB Assembly

Product Details:
Place of Origin: CHINA
Brand Name: HNL-PCBA
Certification: ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
Model Number: PCB Assembly 04
Payment & Shipping Terms:
Minimum Order Quantity: 1 PC
Price: Negotiable
Packaging Details: ESD packaging with carton box
Delivery Time: 1-7days
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Detailed Product Description
Product Name: High Volume PCB Assembly Material: Fr4 High Tg
Copper Thickness: 1OZ To 6OZ Min. Line Width/spacing: 0.030mm
Board Thickness: 2mm ,...... 3.5mm Min. Hole Size: Laser 0.05mm ; Mechnical 0.15
Surface Finishing: HASL Lead Free Solder Mask Color: Blue.green Etc
Service: One-stop Service,PCB&PCBA,ODM And OEM Testing Service: AOI E-test, Function Test,
Number Of Layers: 1-46 Layers PCB Assembly Method: Mixed, SMT, DIP, THT
High Light:

Quick Turn OEM PCBA

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EMS High Volume PCB Assembly

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OEM High Volume PCB Assembly

OEM FR-4 HASL Pb-Free Quick Turn EMS High Volume PCB Assembly

 

High Volume PCB Assembly Introduction

We offer high volume PCBA with SMT as well as THT selective soldering. we can offer bulk volume printed circuit boards to meet your requirements. Although large volumes, each PCB goes through a strict testing process, ensuring that quality is never compromised. For high-volume PCBA order, we offer competitive pricing, as well as flexible shipment plans to you. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .

 

PCB CAPABILITIES

 
FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size Laser 0.075mm Laser 0.05mm
Mechnical 0.15mm Mechnical 0.15mm
5 Min Line Width/Space 0.035mm/0.035mm 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily Output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology. These solutions include:

7 high-speed placement machines,

7 automatic printers with fiducial alignment,

2 X-ray machines,

BGA maintenance machines,

ICT test machines

 

Our DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

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Electronic Board Assembly Process

 

1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test

OEM Quick Turn EMS High Volume PCB Assembly 0

 

Our advantage

 

1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

OEM Quick Turn EMS High Volume PCB Assembly 1

OEM Quick Turn EMS High Volume PCB Assembly 2

 

Electronic Board Assembly Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

 

Electronic Board Assembly Application Field 

 

Our products are widely used in

1.communication equipment,

2.industrial control,

3.consumer electronics,

4.medical equipment,

5.aerospace,

6.light-emitting diode lighting,

7.automotive electronics etc

 

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Workshop

 

OEM Quick Turn EMS High Volume PCB Assembly 4OEM Quick Turn EMS High Volume PCB Assembly 5

OEM Quick Turn EMS High Volume PCB Assembly 6

 

Common packaging

 

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box

 

OEM Quick Turn EMS High Volume PCB Assembly 7

 

Partners

 

OEM Quick Turn EMS High Volume PCB Assembly 8

 

Company Information

 

Haina lean Electronics Co., Ltd is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.

Our company was established in May 1, 2006 in Beijing. And expansion was completed in June 2016. The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.

 

Our first factory is located in Changping District, Beijing, the main radiation Haidian, Changping, Chaoyang three areas of Beijing. Since our company’s establishment, we have been adhering to creating high quality, high efficiency, low-cost business philosophy based on the circuit board processing industry for customers. Most of the key staff of the company are mature technical talents who have been engaged in the industry for more than 10 years, and have rich experience in the production of SMT and DIP, also has rich experience in production for high density & difficulty to package components such as BGA. We obtain a good reputation in the industry through the continuous efforts from all staff and high quality service . Our second branch plant is located in Langfang city, and mainly cover Fengtai and Daxing Yizhuang area. Our factory covers an area of 6000 square meters.

 

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Contact Details
Beijing Haina Lean Electronic CO., LTD

Contact Person: Silvia

Tel: +8618032857825

Send your inquiry directly to us (0 / 3000)