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IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly

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China Beijing Haina Lean Electronic CO., LTD certification
China Beijing Haina Lean Electronic CO., LTD certification
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IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly
IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly

Large Image :  IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly

Product Details:
Place of Origin: CHINA
Brand Name: HNL-PCBA
Certification: ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
Model Number: PCBA-01
Payment & Shipping Terms:
Minimum Order Quantity: 1 PC
Price: Negotiable
Packaging Details: ESD packaging with carton box
Delivery Time: 1-7days
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Detailed Product Description
Product Name: Smt Circuit Board Assembly Copper Thickness: 0.3. 0.56 ..... 6oz
Max Board Size: 700x610mm Custom Min. Line Spacing: 0.030mm
Board Thickness: 0.3-3.5mm Min. Line Width: 0.03mm
Min. Hole Size: Laser 0.05mm ; Mechnical 0.15 Solder Mask Color: Blue.green.red.black.white.etc
Pcb Assembly Method: Mixed,BGA,SMT,Through-hole Certification: RoHS, ISO9001, UL, SGS
Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold Application: Medical Equipments, Consumer Electronics ,automotive Electronics Etc.
High Light:

FR4 SMT PCB Assembly

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Multilayer SMT PCB Assembly

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IPC SMT Board Assembly

IPC Ceramic Plate FR4 material Multi Layer Smt Circuit Board Assembly

 

Smt Circuit Board Assembly Introduction

 

Prototype printed circuit board (PCB) assemblies include surface-mount technology (SMT) PCB prototypes, PCBA prototype assembly, PCB sample assembly, etc. The term prototype PCB Assembly refers to a fast prototype PCBA used to test the function of new electronic designs.

The prototype PCB assembly section of our manufacturing facility has a unique layout that allows for flexible use of both automated and manual parts-loading stations. Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .

 

Our products are mainly exported to Europe and USA. Our customers spread over more than 80 countries. Products are widely used in various industries. many retailers and agents worldwide.

 

PCB CAPABILITIES 

 

Assembly Types: Surface mount, Thro-hole, Mixed technology (SMT & Thru-hole), Single or double sided placement, Conformal coating ,etc .

 

FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size

Laser 0.075mm

Mechnical 0.15

Laser 0.05mm

Mechnical 0.15

5 Min Line Width/Space 0.035mm/0.035 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

 

Our advantage

 

Service value

Independent quotation system to quickly serve the market

 

PCB manufacturing

High-tech PCB and PCB assembly production line

 

Material purchasing

A team of experienced electronic component procurement engineers

 

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 0

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 1

 

Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

 

PCB Assembly Application Field 

 

Printed circuit boards And PCB Assembly are mainly used for many communication industry, medical equipments, consumer electronics ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer ,Auto Industry ,Smart Home.etc.

 

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 2

 

Workshop

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 3

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 4

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 5IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 6

 

 

Partners

 

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 7

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

IPC Ceramic Plate FR4 Multi Layer SMT PCB Assembly 8

 

Company Information

 

Beijing Haina lean Electronics Co.,Ltd is one of the most professional PCB manufacture in Beijing,China. With more then 10 years of development, Haina Lean Electronics turns into a first class manufacture of HDI PCB ,with production capability 4000 square meters.

Our factory is providing high quality bare PCB, PCB layout design service and PCB assembly service,including components sourcing, function test,conformal coating and complete assembly for clients all.

 

We have profuse experience in manufacturing PCB,owned experienced technical R & D technology team, young and professional sales and customer service team, experienced and professional procurement team and assembly testing team, which make sure the products quality of the pass rate, on-time delivery rate of customer orders.

Our services include: circuit board design and layout, 2-46 layers PCB manufacturing, professional FPC production, electronic components purchasing, SMT professional processing, Soldering and Assembly, especially sample and small bulk orders. we have the advantages of a quick quote, fast production, fast delivery.

 

The company pursues "inclusiveness, excellence, people-oriented". Constantly innovate, take technology as the core, regard quality as life, and wholeheartedly provide customers with high-quality and high-efficiency humanized services.We are willing to serve our customers with the principle of continuous honesty & trustworthiness, pragmatism and innovation.

 

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Contact Details
Beijing Haina Lean Electronic CO., LTD

Contact Person: Marina

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