Payment & Shipping Terms:
|Product Name:||FR4 Printed Circuit Board||Material:||FR4, 94v0 Circuit Board|
|Copper Thickness:||0.3OZ, To 6OZ||Min. Line Spacing:||0.030mm|
|Min. Hole Size:||Laser 0.05mm ; Mechnical 0.15mm||Service:||One-stop Service,PCB&PCBA,ODM And OEM|
|PCB Assembly Method:||Mixed, SMT, And THT||Usage:||OEM Electronics,Circuit Board Assembly|
|Board Thickness:||0.3mm-3.5mm||Solder Mask:||Green. Black. Red. Yellow. White. Blue Etc.|
1.6mm FR4 PCB Board,
94v0 FR4 PCB Board,
6 layer PCB board material FR4
Generally using the single-sided PCB in simple electronic devices, which has a layer of conductive material.
Usually use the double-layer PCB in more complex circuits and equipment, and it has a layer of conductive material on both sides.
With the current technological develops fastly, single sided printed circuit boards cannot provide enough space and power.
So, double-sided circuit boards gradually are used more and more in some electronic devices replacing of the single-sided PCB.
The double sided PCB’s surface has copper plating, tin coating, it can withstand high temperatures better than single-sided printed circuit boards.
All of the other electronic components are mounted on the printed circuit boards(PCBs),which are the foundation.
PCBs have mechanical and electrical attributes,making them for ideal applications. Most PCB’s fabricated are rigid, roughly 90% of the PCB’s manufactured today are rigid boards.
|1||HDI Capabilities||HDI ELIC (4+2+4)||HDI ELIC(5+2+5)|
|2||Max layer count||32L||36L|
|3||Board Thickness||Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm||Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm|
|4||Min.Hole Size||Laser 0.075mm||Laser 0.05mm|
|Mechnical 0.15mm||Mechnical 0.15mm|
|5||Min Line Width/Space||0.035mm/0.035mm||0.030mm/0.030mm|
|7||Size Max Panel size||700x610mm||700x610mm|
|11||Max Aspect Ratio||10:1||10:1|
|12||Bow and Twist||0.50%||0.50%|
|13||Impedance Control Tolerance||+/-8%||+/-5%|
|14||Daily Output||3,000m2 (Max capacity of equipment)||4,000m2 (Max capacity of equipment)|
|15||Surface Finishing||ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD|
|16||Raw Material||FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI|
PCB Assembly Process
|Product Type||Qty||Normal lead time||Quick-turn lead time|
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
Contact Person: Silvia