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HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly

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HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly

HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly
HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly

Large Image :  HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly

Product Details:
Place of Origin: CHINA
Brand Name: HNL-PCBA
Certification: ISO9001,IS16949, ISO14001,ROHS ,IPC-A , UL, QC080000
Model Number: Double Side PCB Assembly
Payment & Shipping Terms:
Minimum Order Quantity: 1 PC
Price: Negotiable
Packaging Details: ESD packaging with carton box
Delivery Time: 1-7days
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Detailed Product Description
Product Name: Quick Turn Pcb Assembly Number Of Layers: 1-36 Layers
Copper Thickness: 1/3oz-6oz Min. Line Spacing: 0.030mm ,0.03mm
Board Thickness: 0.3mm-3.5mm Min. Hole Size: Laser 0.05mm ; Mechnical 0.15
Solder Mask Color: Blue.green.red.black.white.etc Material: FR4 /Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
Surface Finishing: HASL Lead Free/ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD Application: Communication Equipment, Industrial Control, Consumer Electronics, Medical Equipment, Aerospace,ect.
High Light:

HF FR4 OSP Double Side PCB Assembly

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4 Layer Double Side PCB Assembly

,

2oz quick turn PCB assembly

HF FR4 OSP 4 Layer Pcb Prototype Double Sided Circuit Board Quick Turn Pcb Assembly

PCB Assembly Introduction

 

Haina Lean Electronics is providing high quality bare PCB,PCB layout design service and PCB assembly service,including components sourcing, function test,conformal coating and complete assembly for clients all.

Producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .

 

The Double-sided circuit board assembly have copper tracking and component pads on the top and bottom side of the PCB board, and often each side is interlinked by through-hole vias. Double-sided assembly requires the placement of components on both sides of the PCB .

To populate the underside with surface mount components, the PCB is inverted and the pasting and component placement process simply repeated. The second pass through the reflow oven does not melt the previously soldered side, as the joints are protected from the direct heat by being on the underside of the assembly.

 

PCB CAPABILITIES

 
FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size Laser 0.075mm Laser 0.05mm
Mechnical 0.15mm Mechnical 0.15mm
5 Min Line Width/Space 0.035mm/0.035mm 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily Output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing HASL lead free/ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

 

PCBA CAPABILITIES

 

PCBA Capability
Material type PCB Components
Item Dimension (Length, width,height. mm) Material Surface finish Chip&IC BGA Pitch QFP Pitch
Min 50*40*0.38 FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC HASL, OSP, Immersion gold, Flash Gold Finger 1005 0.3mm 0.3mm
Max 600*400*4.2    

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology.

These solutions include:

7 high-speed placement machines,

7 automatic printers with fiducial alignment,

2 X-ray machines,

BGA maintenance machines,

ICT test machines

 

Our DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

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Double Side PCB Assembly Process

 

1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test

 

HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly 0

 

Our advantage 

 

1.Service value

Independent quotation system to quickly serve the market

2.PCB manufacturing

High-tech PCB and PCB assembly production line

3.Material purchasing

A team of experienced electronic component procurement engineers

4.SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly 1

 

Why choose us?

 

1. We are the manufacturer/ factory; Welcome to visit us one day.

2. We have good quality control systems, including AOI, ISO 9001 etc. ;

3. All the material we use have the RoHS identify;

4. All the components we use are the New & Original;

5. One-stop service can be provided from PCB design, 1-36 layers PCB manufacturing, components sourcing, PCB Assembly, to Fully Product Assembly.

 

HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly 2

 

PCB Assembly Application Field 

 

Printed circuit boards And PCB Assembly are mainly used for many communication industry, medical equipments, consumer electronics ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer ,Auto Industry ,Smart Home.etc.

 

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Workshop

 

HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly 4

 

HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly 5

 

Common packaging

 

1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box

 

HF FR4 OSP 4 Layer Double Side PCB Assembly , 2oz Quick Turn PCB Assembly 6

 

Partner

 

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Contact Details
Beijing Haina Lean Electronic CO., LTD

Contact Person: Marina

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