Payment & Shipping Terms:
|Product Name:||PCB SMT Assembly||Material:||Fr-4 Normal Tg;HIGH Tg 170 HASL Lead Free|
|Copper Thickness:||1oz, 2oz||Board Thickness:||0.3mm To 3.5mm|
|Min. Hole Size:||Laser 0.05mm ; Mechnical 0.15||Service:||One-stop Service,PCB&PCBA,ODM And OEM|
|PCB Assembly Method:||Mixed; SMT, DIP, THT||Max. Panel Size:||700x610mm;customized|
|MOQ:||1PC||Solder Mask Color:||Green,Blue.green.red.black.white.etc|
Tg150 PCB SMT Assembly,
2.2mm PCB SMT Assembly,
Green multilayer PCB assembly
Surface Mount Technology(SMT) is an alternative to the through-hole method of PCB manufacturing.
And SMT assembly is a method of placing electronic components and circuits onto PCBs.
SMT Assembly Not only includes placing and soldering of components but also a wide array productions.
SMT assembly has a wide range of uses.
We fabricate PCB Assembly with SMT,DIP, BGA, QFP, as well as THT selective soldering.
|1||HDI Capabilities||HDI ELIC (4+2+4)||HDI ELIC(5+2+5)|
|2||Max layer count||32L||36L|
|3||Board Thickness||Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm||Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm|
|4||Min.Hole Size||Laser 0.075mm||Laser 0.05mm|
|Mechnical 0.15mm||Mechnical 0.15mm|
|5||Min Line Width/Space||0.035mm/0.035mm||0.030mm/0.030mm|
|7||Size Max Panel size||700x610mm||700x610mm|
|11||Max Aspect Ratio||10:1||10:1|
|12||Bow and Twist||0.50%||0.50%|
|13||Impedance Control Tolerance||+/-8%||+/-5%|
|14||Daily Output||3,000m2 (Max capacity of equipment)||4,000m2 (Max capacity of equipment)|
|15||Surface Finishing||ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD|
|16||Raw Material||FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI|
|Material||FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC|
|Surface finish||HASL,OSP,Immersion gold,Flash Gold Finger|
Our SMT capabilities:
SMT Assembly: SMT provides a flexible high technology. These solutions include:
7 high-speed placement machines,
7 automatic printers with fiducial alignment,
2 X-ray machines,
BGA maintenance machines,
ICT test machines
Our DIP function:
A-8 semi-assembly production line with four wave soldering machines
1 U-shaped automatic assembly line for box-type building products with test stations
High temperature / low temperature aging test furnace B-4 for products required for aging test
With time control and temperature control
All products are 100% inspected and tested during the DIP process
Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.
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PCB SMT Assembly Process
1.Solder Paste stenciling---2.Surface Mount Technology (Pick and Place)---3.Reflow Soldering---4.Inspection and Quality Control---5.Through-Hole Component Insertion (DIP Process)---6.Final Inspection and Functional Test
Independent quotation system to quickly serve the market
High-tech PCB and PCB assembly production line
A team of experienced electronic component procurement engineers
4.SMT post soldering
Dust-free workshop, high-end SMT patch processing
|Product Type||Qty||Normal lead time||Quick-turn lead time|
Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.
1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box
Contact Person: Silvia