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FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board

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FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board

FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board
FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board

Large Image :  FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board

Product Details:
Place of Origin: CHINA
Brand Name: HNL-PCBA
Certification: ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000
Model Number: PCB Assembly
Payment & Shipping Terms:
Minimum Order Quantity: 1 PC
Price: Negotiable
Packaging Details: ESD packaging with carton box
Delivery Time: 1-7days
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Detailed Product Description
Product Name: HDI PCB Assembly HDI Capabilities: HDI ELIC (5+2+5)
Min. Line Spacing: 0.030mm Copper Thickness: 1/3oz, 1oz, 2oz, ......6oz
Board Thickness: 0.3mm, 0.5mm, 1.6mm,......3.5mm; CUSTOM Solder Mask Color: Green, Or As Required
Surface Finishing: HASL ,Lead Free HASL,ENIG ,Immersion Silver,Immersion Tin,OSP Material: FR-4 High Tg 170°C, FR4 And Rogers Combined Lamination
Min. Hole Size: 0.1mm,0.25mm,0.1mm/4mil,4mil,0.02 Pcb Test: Flying Probe And AOI (Default)/Fixture Test,100% Testing
High Light:

FR-4 HDI PCB Board

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Multilayer HDI PCB Board

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HDI electronic printed circuit board

FR-4 High Precision Motherboard Multilayer Electronic HDI PCB Board

 

HDI PCB Board Introduction

 

HDI PCB Board means as high-density interconnect PCB, is a kind of PCB with a higher wiring density per unit area than traditional boards.

HDI boards are more compact and have smaller vias, pads, copper traces and spaces.

As a result, HDIs have denser wiring resulting in lighter weight, more compact, lower layer count PCBs.

HDI PCB is more fit into the little spaces and have a smaller amount of mass than conservative PCB designs.

Advantages of HDI PCB: High Component Density; Space-saving; Lightweight Boards; Fast Processing; Save Number of Layers; Accommodate Low Pitch Packages; High Reliability

 

Factory Capabilities

 

FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size

Laser 0.075mm

Mechnical 0.15

Laser 0.05mm

Mechnical 0.15

5 Min Line Width/Space 0.035mm/0.035 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

 

The types of HDI PCB Board


1.through vias from surface to surface,
2.with buried vias and through vias,
3.two or more HDI layer with through vias,
4.passive substrate with no electrical connection,
5.coreless construction using layer pairs
6.alternate constructions of coreless constructions using layer pairs.

 

 

FR-4 High Precision Multilayer HDI PCB Board , Electronic Printed Circuit Board 0

 

Work flow for HDI

 

Board Cut - Inner Wet film -DES - AOI - Brown Oxido - Outer Layer Press - Out Layer Lamination - X-RAY & Rounting - Copper reduce & brown oxide - Laser Drilling - Drilling - Desmear PTH - Panel plating - Outer Layer dry film - Etching - AOI- Impedance Testing - S/M Pluged hole - Solder Mask - Component Mark - Impedance testing - Immersion Gold -V-cut - Routing - Electrical Test - FQC - FQA -Package -Shipment

 

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WorkShop

 

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HDI PCB Application Field

 

Automotive and aerospace industries, where lower weight can mean more efficient operation, have been utilizing HDI PCBs at an increasing rate. such as onboard WiFi and GPS, rearview cameras and backup sensors rely on HDI PCBs. As automotive technology continues to advance, HDI tech will likely play an increasingly important role.

 

HDI PCBs are also prominently featured in medical devices; advanced electronic medical devices such as equipment for monitoring, imaging, surgical procedures, laboratory analysis etc., and incorporate HDI boards. The high-density technology promotes improved performance and smaller, more cost-effective devices, potentially improving the accuracy of monitoring and medical testing.

 

Industrial automation requires abundant computerization, and IoT devices are becoming more common in manufacturing, warehousing, and other industrial settings. Many of these advanced equipment employ HDI technology. Today, businesses use electronic tools to keep track of inventory and monitor equipment performance. Increasingly, machinery includes smart sensors that collect usage data and connect to the internet to communicate with other smart devices, as well as to relay information to management and help optimize operations.

 

Except mentioned above, you'll also can find high-density interconnect PCBs in all types of digital devices, like smartphones and tablets, in automobiles, aircraft , mobile /cellular phones, touch-screen devices, laptop computers, digital cameras, 4/5G network communications, and military applications such as avionics and smart munitions.

 

 

Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

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Contact Details
Beijing Haina Lean Electronic CO., LTD

Contact Person: Silvia

Tel: +8618032857825

Send your inquiry directly to us (0 / 3000)