Home ProductsMultilayer PCB Assembly

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly

Certification
China Beijing Haina Lean Electronic CO., LTD certification
China Beijing Haina Lean Electronic CO., LTD certification
I'm Online Chat Now

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly
BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly

Large Image :  BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly

Product Details:
Place of Origin: CHINA
Brand Name: HNL-PCBA
Certification: ISO9001,IS16949, ISO14001,ROHS ,UL, IPC-A ,QC080000
Model Number: PCB Assembly 010
Payment & Shipping Terms:
Minimum Order Quantity: 1 PC
Price: Negotiable
Packaging Details: ESD packaging with carton box
Delivery Time: 1-7days
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Detailed Product Description
Product Name: Multilayer PCB Assembly Material: FR4, CEM-3, HASL Lead Free
Copper Thickness: 1/3oz, 1/2oz, 1oz, 2oz,3oz, ......6oz Min. Line Width/space: 0.030mm/0.030mm
Max Board Size: 700x610mm; Custom Size Board Thickness: Core Thickness 0.05mm-1.5mm ,Fineshed Board Thickness 0.3-3.5mm
Min. Hole Size: Laser 0.05mm;Mechnical 0.15mm Pcb Test: Flying Probe And AOI (Default)/Fixture Test,Flying-Probe PCB Test
Pcb Assembly Method: Mixed,BGA,SMT,Through-hole Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold
High Light:

BGA DIP Multilayer PCB Assembly

,

ISO9001 Multilayer PCB Assembly

,

electronics PCB Components Assembly

FR4 HASL electronics pcb components BGA DIP craft Multilayer PCB Assembly

 

Multilayer PCB Assembly Introduction

 

Multilayer PCB Assembly means we provide you the right PCB production and assembly solution for meeting your specific needs. You can save your money, have shorter lead time, and high-quality products. Our assemblers prepare the PCB boards, procure raw materials & components, finish quality testing & inspection, and final assembly ready for delivery.

We have a professional team who are experienced in handling this delicate process. Our aim to build multifunctional assemblies that serve all your purposes with space limitations to meet your needs.

 

Multilayer Circuit Board Assembly Capabilities
 
FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size

Laser 0.075mm

Mechnical 0.15

Laser 0.05mm

Mechnical 0.15

5 Min Line Width/Space 0.035mm/0.035 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Surface Finishing HASL Lead Free /ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
15 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI
PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -
 

SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology.

These solutions include:

7 high-speed placement machines, 7 automatic printers with fiducial alignment, 2 X-ray machines, BGA maintenance machines, ICT test machines

 

DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

Haina lean Electronics Co.,Ltd is a competitive China customize pcba for medical breathing machine OEM manufacturer, supplier and vendor, you can get quick turn customize pcba for medical breathing machine production prototypes and samples from our factory.

Hot Tags: customize pcba for medical breathing machine, China, supplier, manufacturer, factory, OEM manufacturer, vendor, samples, production, prototypes, quick turn

 

Multilayer PCB Assembly Process

 

1.Solder Paste stenciling
2.Surface Mount Technology (Pick and Place)
3.Reflow Soldering
4.Inspection and Quality Control
5.Through-Hole Component Insertion (DIP Process)
6.Final Inspection and Functional Test

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 0

 

Our advantage

 

Service value

Independent quotation system to quickly serve the market

PCB manufacturing

High-tech PCB and PCB assembly production line

Material purchasing

A team of experienced electronic component procurement engineers

SMT post soldering

Dust-free workshop, high-end SMT patch processing

 

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 1

 

Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD
 

Multilayer PCB Assembly Application Field 

 

Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.

 

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 2

 

Workshop

 

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 3

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 4BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 5

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 6

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 7

 

FAQ

 

1.What are needed for quotation?
PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ......)
PCBA: PCB information, BOM, (Testing documents...)

2. What file formats do you accept for production?
Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)

3.Are my files safe?
Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third party.

4.MOQ?
There is no MOQ .We can flexibly handle small and mass production.

5.Shipping Cost ?

The shipping cost is determined by the destination ,weight ,packing size of the goods .We can provide shipping, air, land, express and other transportation services .

6.How to ensure high-quality production?
The process is strictly controlled under ISO 9001:2015 standards.
Most of our advanced equipment and tools are imported from abroad. Such as Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
We have a very professional QC team.

 

BGA DIP Craft Multilayer PCB Assembly , Electronics PCB Components Assembly 8

Contact Details
Beijing Haina Lean Electronic CO., LTD

Contact Person: Silvia

Tel: +8618032857825

Send your inquiry directly to us (0 / 3000)