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4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly

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China Beijing Haina Lean Electronic CO., LTD certification
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4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly

4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly
4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly

Large Image :  4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly

Product Details:
Place of Origin: CHINA
Brand Name: HNL-PCBA
Certification: ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
Model Number: PCB Assembly 02
Payment & Shipping Terms:
Minimum Order Quantity: 1PC
Price: Negotiable
Packaging Details: ESD packaging with carton box
Delivery Time: 1-7days
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Detailed Product Description
Product Name: PCB Assembly Layer: Double Side , Multilayers
Copper Thickness: 1/3oz To 6oz Max Board Size: 700x610mm Custom
Min. Line Spacing / Width: 0.030mm /0.030mm Board Thickness: 0.3-3.5mm
Material: FR4 CEM1 CEM3 Hight TG Solder Mask: Green/blue/black/red/yellow/white
Surface Finishing: HASL,OSP,ENIG,HASL Lead Free,Immersion Gold Usage: Communication Equipment, Industrial Control, Consumer Electronics, Medical Equipment, Aerospace
High Light:

ISO16949 Through Hole PCB Assembly

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4 Layer Through Hole PCB Assembly

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THT PCB Printing And Assembly

4 layer PCBA Multilayer SMD SMT DIP Through-Hole Process PCB Assembly

Through-Hole Process PCB Assembly Introduction

 

Through-hole PCB assembly are the key in many mission-critical electrical assemblies.
We provide through-hole PCB assembly services to meet conventional lead assembly requirements of a variety of industries. We provide single, double-sided, as well as high-density multilayer Plated Through Hole (PTH) circuit board assembly services to meet requirements of different clients.

 

Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs . Max layer count: 46L

 

PCB CAPABILITIES 

FACTORY CAPABILITIES
No. Items 2019 2020
1 HDI Capabilities HDI ELIC (4+2+4) HDI ELIC(5+2+5)
2 Max layer count 32L 36L
3 Board Thickness Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm Core thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4 Min.Hole Size Laser 0.075mm Laser 0.05mm
Mechnical 0.15mm Mechnical 0.15mm
5 Min Line Width/Space 0.035mm/0.035mm 0.030mm/0.030mm
6 Copper Thickness 1/3oz-4oz 1/3oz-6oz
7 Size Max Panel size 700x610mm 700x610mm
8 Registration Accuracy +/-0.05mm +/-0.05mm
9 Routing Accuracy +/-0.075mm +/-0.05mm
10 Min.BGA PAD 0.15mm 0.125mm
11 Max Aspect Ratio 10:1 10:1
12 Bow and Twist 0.50% 0.50%
13 Impedance Control Tolerance +/-8% +/-5%
14 Daily Output 3,000m2 (Max capacity of equipment) 4,000m2 (Max capacity of equipment)
15 Surface Finishing ENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16 Raw Material FR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

 

PCBA CAPABILITIES

 

PCBA Capability
Material Type Item Min Max
PCB Dimension (length,width,height.mm) 50*40*0.38 600*400*4.2
Material FR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
Surface finish HASL,OSP,Immersion gold,Flash Gold Finger
Components Chip&IC 1005 55mm
BGA Pitch 0.3mm -
QFP Pitch 0.3mm -

 

 

Our SMT capabilities:

 

SMT Assembly: SMT provides a flexible high technology.

These solutions include:

7 high-speed placement machines, 7 automatic printers with fiducial alignment, 2 X-ray machines, BGA maintenance machines, ICT test machines

 

Our DIP function:

 

A-8 semi-assembly production line with four wave soldering machines

1 U-shaped automatic assembly line for box-type building products with test stations

High temperature / low temperature aging test furnace B-4 for products required for aging test

With time control and temperature control

All products are 100% inspected and tested during the DIP process

 

 

PCB Assembly Process

 

1.Solder Paste stenciling
2.Surface Mount Technology (Pick and Place)
3.Reflow Soldering
4.Inspection and Quality Control
5.Through-Hole Component Insertion (DIP Process)
6.Final Inspection and Functional Test

4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 0

 

Why choose us?

 

Reliable PCB Manufacturing & Assembly; Quality PCB Fabrication; Best On Time PCB Shipping Record; Financially Stable PCB Company; 24 Hour Tech Support; PCB Instant Quoting; Easy PCB Order Status Tracking; No Minimum PCB Order Requirements; Waived Tooling Charges; Free PCB Design Software & Free File Check.

 

Our advantage 

 

Service value:

Independent quotation system to quickly serve the market

PCB manufacturing:

High-tech PCB and PCB assembly production line

Material purchasing:

A team of experienced electronic component procurement engineers

SMT post soldering:

Dust-free workshop, high-end SMT patch processing

 

4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 1

4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 2

 

Delivery Time 

 

Product Type Qty Normal lead time Quick-turn lead time
SMT+DIP 1-50 1WD-2WD 8H
SMT+DIP 51-200 2WD-3WD 1.5WD
SMT+DIP 201-2000 3WD-4WD 2WD
SMT+DIP ≥2001 4WD-5WD 3WD
PCBA(2-4Layer) 1-50 2.5WD-3.5WD 1WD
PCBA(2-4Layer) 51-2000 5WD-6WD 2.5WD
PCBA(2-4Layer) ≥2001 ≥7WD 5WD
PCBA(6-10Layer) 1-50 3WD-4WD 2.5WD
PCBA(6-10Layer) 51-2000 7WD-8WD 6WD
PCBA(10-HDILayer) 1-50 7WD-9WD 5WD
PCBA(10-HDILayer) 51-2000 9WD-11WD 7WD

 

Through-Hole Process PCB Assembly Application Field 

 

PCB Assembly are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics.

 

4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 3

 

Workshop

 

4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 44 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 54 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 6

 

Partners

 

4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 7

 

Common packaging


PCB: Vacuum packaging with carton box
PCBA: ESD packaging with carton box

 

4 Layer PCBA SMD SMT DIP Through Hole PCB Assembly 8

 

FAQ

 

FAQ

1.What are needed for quotation?
PCB: Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ......)
PCBA: PCB information, BOM, (Testing documents...)

2. What file formats do you accept for production?
Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)

3.Are my files safe?
Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.. All documents from customers are never shared with any third party.

4.MOQ?
There is no MOQ .We can flexibly handle small and mass production.

5.Shipping Cost ?

The shipping cost is determined by the destination ,weight ,packing size of the goods .We can provide shipping, air, land, express and other transportation services .

6.How to ensure high-quality production?
The process is strictly controlled under ISO 9001:2015 standards.
Most of our advanced equipment and tools are imported from abroad. Such as Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
We have a very professional QC team.

Q7.What are the services you can provide ?

One-stop contract manufacturing
A:PCB Assembly;
B:PCB Design & Layout
C:PCBA programming & functional testing;
D:Electronic components purchasing service;
E:Enclosure molding & final assembly with labels,instructions,enclosure, boxes.

Q8.Whether all PCBA s will be tested before delivery ?

Yes , we will test each piece of PCBA product under your testing methods ,to ensure quality and functionality .

Q9.Do you provide OEM service ?

Yes ,we offer PCB and PCBA OEM Service , we manufacture the PCB and PCBA products to your design and requirements .

 

Company Information

 

Haina lean Electronics Co., Ltd is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.

Our company was established in May 1, 2006 in Beijing. And expansion was completed in June 2016. The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.

 

Our first factory is located in Changping District, Beijing, the main radiation Haidian, Changping, Chaoyang three areas of Beijing. Since our company’s establishment, we have been adhering to creating high quality, high efficiency, low-cost business philosophy based on the circuit board processing industry for customers. Most of the key staff of the company are mature technical talents who have been engaged in the industry for more than 10 years, and have rich experience in the production of SMT and DIP, also has rich experience in production for high density & difficulty to package components such as BGA. We obtain a good reputation in the industry through the continuous efforts from all staff and high quality service . Our second branch plant is located in Langfang city, and mainly cover Fengtai and Daxing Yizhuang area. Our factory covers an area of 6000 square meters.

 

Our company pursues "inclusiveness, excellence, people-oriented". Constantly innovate, take technology as the core, regard quality as life, and wholeheartedly provide customers with high-quality and high-efficiency humanized services.We are willing to serve our customers with the principle of continuous honesty & trustworthiness, pragmatism and innovation.

 

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Contact Details
Beijing Haina Lean Electronic CO., LTD

Contact Person: Marina

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